For hyperscale, sovereign cloud, and specialized HPC customers, T18 offers full custom platform engineering — bespoke chassis, firmware, thermals, and long-cycle roadmap commitments — from the Dubai design center.
Custom mechanical, backplane and I/O designs for hyperscale racks, sovereign cloud form factors, and unique thermal envelopes.
Custom BMC surfaces, in-region firmware key custody, and integration with your NOC and lifecycle management stack.
Air, direct-liquid, and immersion-ready thermal solutions co-designed with your rack, aisle, and facility team.
Two to four weeks of joint workshops with your infrastructure and workload teams to lock functional, thermal, power, and firmware requirements.
A T18 engineering pod builds the reference design — mechanical, electrical, firmware architecture — and reviews with your team at defined checkpoints.
Prototype builds run through the T18 thermal chamber, EMC lab, and firmware validation harness. Test reports delivered against your acceptance criteria.
A limited pilot lands in your production environment for burn-in and operational sign-off before full production ramp.
Full production ramp with committed lead times, plus a sustaining engineering commitment for the program lifecycle (typically 5–10 years).
12-rack AI training cluster with sovereign firmware baseline and DLC thermal loop. Bespoke management plane integration.
Ultra-density 4U JBOD with dual-path NVMe-oF gateway and custom OCP fabric mezzanine.
NEMA-4X ruggedized edge platform with tactical DC power input and cellular out-of-band management.